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让金融更科技,2020中新金博会在苏州开幕

2020-09-16 由 发布 阅读(14)

2020年9月16日,第二届中新(苏州)金融科技应用博览会(以下简称“金博会”)在苏州国际博览中心拉开帷幕。本次展会以“让金融更科技”为主题,全面提升对国内外金融科技创新资源的整合能力,致力于搭建金融科技跨领域交流合作平台,推动金融科技产业生态的互联互通。东吴证券携手东吴金融科技将系列金融科技成果在展会上分享。

第二届中新(苏州)金融科技应用博览会

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苏州市委副书记、市长李亚平讲话

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参展商

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东吴证券和东吴金融科技展厅

qizhong,bencidongwuzhanqufenxiangdejishuchanpinyufuwubaohanjiaoyijishu、qukuailianhedashuju、yunyingfuneng、yunjisuansidalei,xiyinledaliangyuhuizheqianlaijiaoliu、tiyan。

交易技术、区块链和大数据、运营赋能、云计算

cicizhanhuijiangchixudaobenzhouwu,zhantingweiyusuzhouguojibolanzhongxingqu3lou,chengyaoyeneitongrenlilinjiaoliu,yudongwujinrongkejigongtan“kejigaibianjinrong”defazhandaolu。

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